Staff Assembly Engineer - Manila, Alabang, Philippines
About the role
This role involves working with subcontractors on assembly process characterization and managing new product/package introduction for Navitas Semiconductor.
What you'll do
- Work with subcontractors on Assembly Processes Characterization.
- Review and generate Process specifications and other documents.
- Collaborate with subcontractors on designing and improving leadframe and BOM.
- Manage and prevent risks in running NPI products in assembly.
- Support investigation and resolution of quality, yield, and customer return issues.
- Lead overall execution locally at subcon facilities with the global team.
What you'll need
- Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
- Fluency in English in writing and speaking.
- At least 5 years process engineering experience in a semiconductor backend facility.
- Experience with Wafer Saw, Laser Groove, DB, WB, or EOL Assy.
- Experience with Engineering Problem Solving Tools like FMEA, SPC, Control plan, OCAP, 8D, MSA.
Nice to have
- Experience in the whole Assembly Process (from Dicing to Singulation & Tape and Reel).
Skills: Assembly Processes Characterization, New Product/Package Introduced, leadframe, BOM, NPI products, semiconductor backend facility
This role has been open 14 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
201
|
Median days open
65 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Navitas Semiconductor | All employers we track in this specialty (201 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 201 |
| Open roles in the wider Process, Fab & Equipment family | 8 | 9348 · 109 employers |
| Median days open | 33 d | 65 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: Assembly Processes Characterization, New Product/Package Introduced, leadframe, BOM, NPI products, semiconductor backend facility
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 27 d
- Micron Technology · 21 open roles · median 138 d
- Renesas Electronics · 19 open roles · median 20 d
- Intel Corporation · 12 open roles · median 144 d
- Monolithic Power Systems · 12 open roles · median 180 d
- onsemi · 7 open roles · median 60 d
How we counted: 201 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 16 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.