Staff Advanced Packaging/Process Engineer of R&D - USA - CA - San Jose (Ridder), United States
$112,050 - $160,050 USD yearly
Originally posted 14 October 2026 by the employer.
Develop packaging solutions for optical and photonic devices.
About the role
This role drives the development of packaging solutions for optical and photonic devices within an R&D context. It involves innovating and optimizing processes for high-performance, reliable, and cost-effective packaging.
What you'll do
- Lead the design, development, and optimization of advanced packaging processes for new optical and photonic products.
- Conduct hands-on process development, characterization, and troubleshooting for packaging technologies, including die attach, wire bonding, flip-chip, optical alignment, and hermetic sealing.
- Develop and implement process control strategies, statistical process control (SPC), and design of experiments (DOE) to improve yield, reliability, and manufacturability.
- Collaborate with cross-functional teams including design, product engineering, reliability, and manufacturing to ensure seamless transfer of new packaging technologies.
- Evaluate and select new materials, equipment, and manufacturing techniques to enhance packaging performance, reduce cost, and improve throughput.
- Perform root cause analysis for packaging-related failures and implement corrective actions.
What you'll need
- Master's or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related discipline.
- 8+ years of experience in advanced packaging or process engineering within the optoelectronics, photonics, or semiconductor industry, with a strong R&D focus.
- Expertise in multiple packaging technologies such as chip-on-board (COB), flip-chip, wafer-level packaging (WLP), system-in-package (SiP), hermetic sealing, and optical assembly.
- Proficiency with various bonding techniques including wire bonding, thermocompression bonding, and epoxy attach.
- Strong understanding of materials science principles relevant to packaging, including adhesives, solders, encapsulants, and substrates.
- Hands-on experience with packaging equipment, including pick-and-place, wire bonders, reflow ovens, and optical alignment systems.
- Solid knowledge of statistical process control (SPC), design of experiments (DOE), and failure analysis techniques.
Nice to have
- Experience with CAD tools for package design and simulation.
Skills: advanced packaging, optical, photonic devices, die attach, wire bonding, flip-chip, hermetic sealing
This role has been open 0 days — well below the 42-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
65
|
Median days open
42 d
|
Median salary
$171k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lumentum | All employers we track in this specialty (65 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 65 |
| Median days open | 0 d | 42 d (−42 d vs this employer) |
| Median salary (USD postings) | — | $171k |
Skills observed across this category: advanced packaging, optical, photonic devices, die attach, wire bonding, flip-chip
Who's hiring in this category
- Micron Technology · 10 open roles · median 165 d
- AMD · 8 open roles · median 45 d
- Marvell Technology · 5 open roles · median 33 d
- Broadcom · 4 open roles · median 136 d
- GlobalFoundries · 4 open roles · median 104 d
- NVIDIA · 4 open roles · median 59 d
How we counted: 65 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.