Packaging Design Engineer - TX, Austin, United States
Originally posted 14 October 2026 by the employer.
About the role
What you'll do
- Perform end-to-end package design execution for complex products.
- Handle multiple concurrent design programs.
- Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
- Drive design decisions through collaboration with SI/PI, mechanical, and SOC teams.
- Partner with internal engineering teams, OSATs, and substrate suppliers.
- Define and enhance package design methodologies, flows, and best practices.
What you'll need
- Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
- Experience as a package or silicon physical designer.
- Ability to apply AI/ML and automation to improve design productivity and quality.
- Experience with EDA tools.
- Understanding of Signal Integrity and Power Integrity fundamentals.
Nice to have
- Designing complex substrate design or Silicon Bridge or Interposers.
- Experience in multi-project environments.
- Experience working with OSATs, foundries, and substrate vendors.
Skills: Package Design Engineer, advanced packaging, 2.5D/3D, chiplet-based architectures, substrate layouts
This role has been open 0 days — well below the 42-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
65
|
Median days open
42 d
|
Median salary
$171k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (65 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 65 |
| Median days open | 40 d | 42 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $171k |
Skills observed across this category: Package Design Engineer, advanced packaging, 2.5D/3D, chiplet-based architectures, substrate layouts
Who's hiring in this category
- Micron Technology · 10 open roles · median 165 d
- AMD (this employer) · 8 open roles · median 45 d
- Marvell Technology · 5 open roles · median 33 d
- Broadcom · 4 open roles · median 136 d
- GlobalFoundries · 4 open roles · median 104 d
- NVIDIA · 4 open roles · median 59 d
How we counted: 65 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.
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