Sr Staff Package Design Engineer - Bengaluru, India
Originally posted 29 September 2026 by the employer.
About the role
This role is for a Sr Staff Package Design Engineer.
What you'll do
(No responsibilities provided in the SOURCE description)
What you'll need
(No required qualifications provided in the SOURCE description)
Skills: Package Design, advanced packaging, chiplet, interposer, 3D IC
This role has been open 0 days — well below the 41-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
41 d
|
Median salary
$173k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (69 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 69 |
| Median days open | 3 d | 41 d (−38 d vs this employer) |
| Median salary (USD postings) | — | $173k |
Skills observed across this category: Package Design, advanced packaging, chiplet, interposer, 3D IC
Who's hiring in this category
- Micron Technology · 12 open roles · median 151 d
- AMD · 6 open roles · median 35 d
- Marvell Technology · 6 open roles · median 21 d
- Broadcom · 5 open roles · median 171 d
- Amazon · 4 open roles · median 20 d
- Intel Corporation · 4 open roles · median 11 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.