Sr. Director, Chiplets/FCBGA Integration - Tempe, AZ, United States
Originally posted 18 September 2026 by the employer.
About the role
This role leads the strategy, development, and execution of advanced chiplet-based module technologies, including HDFO (High Density Fan-Out) and advanced IC package solutions for AI, computing, networking, and PC client markets. You will serve as a key technical interface between Tier 1 customers and Amkor's R&D center in South Korea to drive roadmaps and commercialization.
What you'll do
- Lead advanced IC package development initiatives with customers and development teams in Korea, aligning technical solutions with customer and market requirements. - Drive strategic engagements with Tier 1 customers, including technology roadmap discussions, development reviews, and executive-level communications. - Oversee packaging architectures, materials, thermal management, warpage control, and heterogeneous integration technologies. - Direct cross-functional teams across package design, materials characterization, simulation, reliability, and process development resources. - Guide product development from concept through qualification, technology transfer, and production ramp. - Manage program objectives, schedules, risks, and customer expectations for AI, high-performance computing, and networking packaging programs.
What you'll need
- Bachelor's degree in Engineering (Mechanical Engineering or Materials Science preferred). - 12+ years of experience in semiconductor packaging development, including leading advanced packaging or product development programs. - Technical understanding of IC package design trade-offs for FCBGA and heterogeneous module-based package development. - Working knowledge of mechanical stress/strain and IC package warpage derived from packaging materials and mechanical configurations. - Familiarity with Co-Packaged Optics, current trends, and performance drivers. - Deep knowledge of IC packaging materials, failure modes, and reliability qualification procedures.
Nice to have
- Master's degree in Mechanical Engineering, Materials Science, or related engineering discipline. - Demonstrated experience developing package technology roadmaps for AI accelerators, high-performance computing, and data center applications. - Expertise in Fan-Out IC Packaging, including low-density (LDFO), high-density (HDFO), and bridge-based heterogeneous products. - Expertise in large-body FCBGA packaging, including warpage control, stress management, underfill, and TIM materials. - Working knowledge of semi-additive plating chemistries and equipment, along with familiarity in Design of Experiments (DOE) and Statistical Process Control (SPC).
Skills: FCBGA, heterogeneous integration, chiplets, warpage control, advanced packaging
This role has been open 0 days — well below the 50-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
72
|
Median days open
50 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amkor | All employers we track in this specialty (72 roles · 25 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 72 |
| Median days open | 0 d | 50 d (−50 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: FCBGA, heterogeneous integration, chiplets, warpage control, advanced packaging
Who's hiring in this category
- AMD · 11 open roles · median 51 d
- Micron Technology · 9 open roles · median 180 d
- NVIDIA · 7 open roles · median 29 d
- Marvell Technology · 6 open roles · median 25 d
- Broadcom · 4 open roles · median 150 d
- GlobalFoundries · 4 open roles · median 118 d
How we counted: 72 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 25 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.