SOSM QFN Die Bond and Wire Bond Equipment Engineer - Seremban, Negeri Sembilan, Malaysia
Originally posted 11 September 2026 by the employer — open 0 days.
About the role
This role involves sustaining, maintaining, and improving Die Bond and Wire Bond equipment within semiconductor assembly manufacturing operations. The focus is on equipment reliability, uptime, preventive and predictive maintenance, and continuous improvement for SOSM QFN packaging.
What you'll do
- Provide engineering support for Die Bond and Wire Bond equipment to ensure high equipment uptime and manufacturing efficiency.
- Lead equipment troubleshooting and root cause analysis for machine-related issues.
- Develop and implement corrective and preventive actions to improve equipment reliability.
- Monitor and analyze equipment performance indicators like OEE, MTBF, MTTR, utilization, and downtime trends.
- Lead continuous improvement and cost-reduction projects to improve equipment productivity and availability.
- Support equipment installation, setup, conversion, qualification, acceptance testing, and release to production.
- Develop, optimize, and maintain preventive maintenance and predictive maintenance programs.
- Work with equipment suppliers to resolve technical issues and implement upgrades.
- Drive automation, digitalization, and Industry 4.0 initiatives.
- Support new product introduction, engineering builds, technology transfers, and product qualification activities.
What you'll need
- Bachelor’s Degree in Electrical & Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Manufacturing Engineering, Automation Engineering, Industrial Engineering, or equivalent engineering qualification. Or, Diploma with at least 5 years of relevant industry experience.
- Minimum 2-5 years of experience in semiconductor manufacturing or equipment engineering.
- Hands-on experience supporting Die Bond and/or Wire Bond equipment.
- Experience in equipment maintenance, troubleshooting, optimization, and reliability improvement within a manufacturing environment.
- Strong knowledge of Die Bond and Wire Bond equipment operation, maintenance, and troubleshooting.
- Understanding of servo systems, motion control, vision systems, sensors, pneumatics, and machine control systems.
- Knowledge of preventive maintenance, predictive maintenance, Total Productive Maintenance, and equipment reliability methodologies.
- Familiarity with OEE, MTBF, MTTR, FMEA, SPC, and structured root cause analysis.
- Experience with equipment qualification, validation, acceptance, and machine capability studies.
This role has been open 0 days — well below the 45-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3550
|
Median days open
45 d
|
Median salary
$128k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (3550 roles · 82 employers) |
|---|---|---|
| Open roles in this specialty | 81 | 3550 |
| Open roles in the wider Process, Fab & Equipment family | 267 | 9235 · 110 employers |
| Median days open | 45 d | 45 d (same as this employer) |
| Median salary (USD postings) | — | $128k |
Who's hiring in this category
- Applied Materials · 594 open roles · median 44 d
- Lam Research · 531 open roles · median 35 d
- KLA Corporation · 220 open roles · median 52 d
- Micron Technology · 196 open roles · median 39 d
- ASML · 186 open roles · median 57 d
- ASM International · 139 open roles · median 66 d
How we counted: 3550 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 82 employers tracked in the SemiconductorJobs index, counted 11 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.