SiP Layout Design Engineer - MA, Wilmington, United States
$116,960 - $160,820 USD yearly
Originally posted 2 September 2026 by the employer.
This role supports the development of system-in-package products.
About the role
This role involves the layout design of System-in-Package (SiP) for advanced semiconductor packaging applications. This includes supporting the development of flip-chip packages, system-in-package products, and module-based solutions.
What you'll do
- Develop laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
- Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups.
- Collaborate with IC design, package engineering, and product engineering teams to meet product and package specifications.
- Perform design rule checks, layout verification, and design reviews.
- Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis.
- Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials.
What you'll need
- Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
- 5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design.
- Strong understanding of laminate, substrate, and PCB layout principles, including routing, stack-up design, power/ground plane design, via design, impedance control, creepage/clearance, and manufacturability constraints.
- Strong knowledge of package structures, including BGA, LGA, flip-chip, system-in-package, multi-die packages, and module-based products.
- Proficiency in Cadence Allegro and CAD software.
- Familiarity with signal integrity, power integrity, thermal, mechanical, and reliability considerations in layout design.
Skills: package layout design, laminate, substrate, PCB, Cadence Allegro, system-in-package
This role has been open 21 days — well below the 41-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
67
|
Median days open
41 d
|
Median salary
$178k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Analog Devices | All employers we track in this specialty (67 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 67 |
| Median days open | 21 d | 41 d (−20 d vs this employer) |
| Median salary (USD postings) | — | $178k |
Skills observed across this category: package layout design, laminate, substrate, PCB, Cadence Allegro, system-in-package
Who's hiring in this category
- Micron Technology · 13 open roles · median 146 d
- AMD · 6 open roles · median 30 d
- Marvell Technology · 6 open roles · median 16 d
- Broadcom · 5 open roles · median 166 d
- NVIDIA · 4 open roles · median 56 d
- Amazon · 3 open roles · median 15 d
How we counted: 67 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.