Silicon Photonics Advanced Packaging Intern (Summer 2027) - Malta, New York, United States of America, United States
$20 - $40 USD hourly
Originally posted 3 September 2026 by the employer. Relisted by the employer on 13 October 2026.
Support development of electro-optical transceivers using GF's Photonix platform.
About the role
This internship supports the development of electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role contributes to thermal, mechanical, electrical, and optical chip-package co-design with a focus on module performance, reliability, packaging design, materials selection, and advanced chiplet integration requirements.
What you'll do
- Support Silicon Photonics advanced packaging innovation and customer design enablement.
- Participate in cross-functional design reviews and use engineering analysis to resolve technical, manufacturability, reliability, and yield concerns.
- Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality.
- Contribute to qualification robustness and continuous improvement plans by applying consistent design processes and tracking requirements.
- Support product development from concept through production readiness.
What you'll need
- Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or a related field.
- Overall 3.0 GPA.
- English language fluency (written & verbal).
- Ability to travel up to 10%.
- Ability to work at least 40 hours per week during the internship.
Nice to have
- Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
- Exposure to thermal, mechanical, electrical, optical, or multiphysics simulation tools.
- Knowledge of semiconductor packaging, chiplets, silicon photonics, or co-packaged optics.
This role has been open 43 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
61 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (299 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 352 | 9874 · 109 employers |
| Median days open | 60 d | 61 d (−1 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 43 open roles · median 128 d
- Micron Technology · 38 open roles · median 37 d
- Renesas Electronics · 17 open roles · median 47 d
- Intel Corporation · 16 open roles · median 41 d
- GlobalFoundries (this employer) · 14 open roles · median 60 d
- Infineon Technologies · 14 open roles · median 66 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.