Silicon Packaging Engineer - Intern & New Grad - Mountain View, CA, United States
Originally posted 11 September 2026 by the employer.
Join the team building Passage™, the world's first 3D-stacked photonics engine.
About the role
This role involves contributing to the Silicon Packaging team, focusing on the intersection of electrical, mechanical, optical, and thermal engineering to bring co-packaged optics from concept to high-volume production. The team is building the world's first photonic engine for AI at scale.
What you'll do
- Contribute to Signal & Power Integrity, including high-speed interface analysis (PCIe, UCIe, SerDes), PDN design and simulation, eye diagrams, jitter, and S-parameters.
- Engage in Thermal Engineering, including CFD simulation, heat sink and TIM evaluation, liquid cooling, and package-level thermal analysis.
- Work on Mechanical & Thermo-Mechanical Design, including structural analysis, tolerance stack-up, GD&T, FEA, solder fatigue, and CTE mismatch.
- Support Packaging Integration, including 2.5D/3D packaging, fiber attach, heterogeneous integration, assembly yield, and reliability.
What you'll need
- Currently pursuing or recently completed a BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
- Hands-on experience through coursework, capstone projects, research labs, or internships.
- Familiarity with at least one relevant tool such as SolidWorks, ANSYS, ADS, Cadence, Python, or MATLAB.
This role has been open 18 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
308
|
Median days open
57 d
|
Median salary
$164k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lightmatter | All employers we track in this specialty (308 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 308 |
| Open roles in the wider Process, Fab & Equipment family | 2 | 9593 · 108 employers |
| Median days open | 18 d | 57 d (−39 d vs this employer) |
| Median salary (USD postings) | — | $164k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 110 d
- Micron Technology · 36 open roles · median 34 d
- Infineon Technologies · 18 open roles · median 49 d
- Renesas Electronics · 18 open roles · median 25 d
- onsemi · 15 open roles · median 21 d
- Intel Corporation · 13 open roles · median 68 d
How we counted: 308 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 30 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.