Silicon Packaging Design Engineer - Bangalore, India
Originally posted 1 October 2026 by the employer.
Join our Data Center Group to develop silicon packaging solutions.
About the role
What you'll do
- Drive the complete development of substrate designs from initial concept through tapeout. - Perform physical layout and routing of package designs, ensuring adherence to design requirements. - Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost. - Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations. - Define and implement substrate design rules to meet product and manufacturing requirements. - Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs). - Integrate design documentation and collateral into the product lifecycle management system. - Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.
What you'll need
- Diploma in Electronic/ Electrical Engineering or a related field. - Six months or more of work experience in Semiconductor field related to design of silicon packaging or PCB. - Novice to intermediate proficiency in substrate design and development, including physical layout and routing. - Basic understanding of I/O fundamentals, package interconnect, and power delivery principles. - Familiarity with design for manufacturability (DFM) and quality assurance processes. - Strong problem-solving skills with a disciplined approach to execution.
Nice to have
- Experience into E-CAD tool.
Skills: Silicon Packaging, substrate designs, physical layout, routing, DFM
This role has been open 2 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
195
|
Median days open
61 d
|
Median salary
$163k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (195 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 195 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9571 · 109 employers |
| Median days open | 173 d | 61 d (+112 d vs this employer) |
| Median salary (USD postings) | — | $163k |
Skills observed across this category: Silicon Packaging, substrate designs, physical layout, routing, DFM
Who's hiring in this category
- Infineon Technologies · 26 open roles · median 45 d
- Renesas Electronics · 23 open roles · median 37 d
- Micron Technology · 17 open roles · median 151 d
- onsemi · 13 open roles · median 18 d
- Monolithic Power Systems · 11 open roles · median 198 d
- Intel Corporation (this employer) · 8 open roles · median 173 d
How we counted: 195 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 4 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.