Silicon Packaging Design Engineer - Bangalore, India
Originally posted 1 October 2026 by the employer.
Join our Data Center Group to develop silicon packaging solutions.
About the role
What you'll do
- Drive the complete development of substrate designs from initial concept through tapeout. - Perform physical layout and routing of package designs, ensuring adherence to design requirements. - Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost. - Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations. - Define and implement substrate design rules to meet product and manufacturing requirements. - Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs). - Integrate design documentation and collateral into the product lifecycle management system. - Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.
What you'll need
- Diploma in Electronic/ Electrical Engineering or a related field. - Six months or more of work experience in Semiconductor field related to design of silicon packaging or PCB. - Novice to intermediate proficiency in substrate design and development, including physical layout and routing. - Basic understanding of I/O fundamentals, package interconnect, and power delivery principles. - Familiarity with design for manufacturability (DFM) and quality assurance processes. - Strong problem-solving skills with a disciplined approach to execution.
Nice to have
- Experience into E-CAD tool.
Skills: Silicon Packaging, substrate designs, physical layout, routing, DFM
This role has been open 25 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
214
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (214 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 194 | 10125 · 107 employers |
| Median days open | 111 d | 58 d (+53 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Silicon Packaging, substrate designs, physical layout, routing, DFM
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 39 d
- Infineon Technologies · 25 open roles · median 43 d
- Micron Technology · 21 open roles · median 42 d
- onsemi · 17 open roles · median 32 d
- Intel Corporation (this employer) · 11 open roles · median 111 d
- Monolithic Power Systems · 11 open roles · median 221 d
How we counted: 214 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.