Shift Process Engineer, Advanced Packaging Technology Development (APTD) - Boise, ID - Main Site
Originally posted 1 September 2026 by the employer.
About the role
This role involves supporting and improving assembly processes within a development environment, focusing on new packaging technologies for memory and storage solutions.
What you'll do
- Identify, diagnose, and resolve process issues using failure analysis, FMEA, 8D, SPC, and FDC methodologies.
- Analyze process and manufacturing data to improve yield, product quality, and cost performance.
- Partner with engineering, operations, suppliers, and global sites to optimize process performance and resolve technical challenges.
- Monitor process trends and implement improvements to increase process capability and equipment effectiveness.
- Support evaluation and qualification of process changes, materials, and vendor solutions.
What you'll need
- Bachelor’s degree in Engineering, Materials Science, Physics, Chemistry, or a related technical field.
- Experience analyzing data to solve technical problems and drive process improvements.
- Knowledge of SPC principles and process control methodologies.
- Ability to communicate technical information effectively across diverse audiences.
- Experience using AI-enabled tools such as Copilot, Claude, Gemini, or similar applications.
Nice to have
- Understanding of semiconductor manufacturing processes and process equipment.
- Knowledge of FMEA, 8D, FDC, APC, RMS, or related manufacturing systems.
- Understanding of gas behavior, chemical reactions, and their impact on manufacturing processes.
- Proficiency with Microsoft Office applications and data analysis tools.
This role has been open 22 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 1468 | 9525 · 109 employers |
| Median days open | 33 d | 58 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology (this employer) · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.