Senior Staff Packaging Engineering - Batu Kawan, my, Malaysia
Originally posted 1 September 2026 by the employer.
About the role
This role involves driving innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will own the package lifecycle and define, develop, and qualify emerging packaging technologies.
What you'll do
- Serve as the Package Engineering representative on cross functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production.
- Provide end to end ownership of the package lifecycle across design, development, qualification, and manufacturing.
- Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost effective high volume introduction of new package designs and advanced assembly processes.
- Drive enterprise level assembly yield improvement initiatives and package cost reduction programs.
- Own package technology roadmaps and guide the development of scalable packaging infrastructure.
- Lead new products through the transition from low volume to high volume manufacturing, ensuring yield, quality, and reliability objectives are achieved.
- Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework).
What you'll need
- Master’s degree or PhD in Material Science, Manufacturing, Mechanical Engineering, Computer Science, Physics or other engineering disciplines.
- Minimum 10 years of relevant work experience with a Master's degree, or 8+ years of experience with a PhD.
- Proficient understanding of packaging domains including SMT, PCBA, solder joint reliability, board-level reliability, packaging materials, failure analysis, and PCB layout.
- Experience with machine learning and data analytics utilizing AI technologies.
- Demonstrated expertise in experimental design and statistical analysis.
- Knowledge of thermo-mechanical aspects of semiconductor packages and Solid-State Drives.
- Familiarity with industry benchmarking trends and packaging technology roadmap development.
Nice to have
- Additional expertise in flash back-end process for active components manufacturing.
- Experience mentoring or managing junior engineers.
Skills: packaging solutions, package lifecycle, assembly processes, DFX, package technology roadmaps
This role has been open 23 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | SanDisk | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 85 | 9525 · 109 employers |
| Median days open | 23 d | 58 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: packaging solutions, package lifecycle, assembly processes, DFX, package technology roadmaps
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.