Senior Staff Engineer Unit Process Engineering - Melaka, Malaysia
Originally posted 22 September 2026 by the employer — open 0 days.
About the role
This role involves serving as a technical expert for molding processes within semiconductor packaging, making critical product quality decisions, and leading complex defect investigations.
What you'll do
- Serve as the final technical expert for "go/no-go" decisions on product quality when molding issues or excursions happen.
- Lead root-cause analysis for complex molding defects with a strong understanding of fluid dynamics to resolve issues like localized wire sweep, S-curve deformations, and mold void.
- Optimize transfer molding parameters including transfer speed, injection pressure, and cure profiles to protect high-density wire profiles.
- Review, approve, and ensure proper gate placement, runner balance, and venting before tooling fabrication.
- Guide and mentor engineers to improve the team's overall technical problem-solving capabilities.
What you'll need
- Bachelor's Degree in Electrical, Mechanical, Electronic, or Materials Engineering, or other semiconductor-related areas.
- Minimum 5 years of working experience in a semiconductor environment or related field.
- Hands-on experience in semiconductor packaging, with a special focus on transfer molding (MapMold and Cavity).
- Highly proficient in moldability concepts to predict and prevent overall molding defects.
- Strong communication skills with the confidence to deliver clear, data-backed recommendations and risk assessments directly to management.
Skills: molding processes, transfer molding, semiconductor packaging, root-cause analysis, tooling design
This role has been open 0 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 28 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 323 | 9417 · 108 employers |
| Median days open | 33 d | 68 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: molding processes, transfer molding, semiconductor packaging, root-cause analysis, tooling design
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.