Senior Staff Engineer Package Technology - Melaka, Malaysia
Originally posted 10 September 2026 by the employer — open 10 days.
Work on lead frame, substrate, and packing material development projects.
About the role
This role involves serving as a technical expert for lead frame, substrate, and packing material development within the Research & Development team.
What you'll do
- Serve as the technical expert for lead frame, substrate, and packing material development projects.
- Design, prepare drawings, and define specifications for lead frames and substrates based on design guidelines and assembly rules.
- Collaborate with internal teams and material suppliers on packing material design, specification, and selection.
- Drive lead frame, substrate, and packing material development activities to achieve project milestones and cost targets.
- Liaise with SQM and suppliers to ensure fulfillment of quality requirements, FAI completion, and qualification release.
- Establish design guidelines and requirements for lead frame, substrate, and packing material specifications.
- Generate technical papers, journals, and patents related to lead frame, substrate, and package design.
- Support incoming material quality activities and work with suppliers and internal teams to resolve technology and quality issues.
- Participate in lead frame and packing material technology roadmapping, UPEG activities, and material selection.
What you'll need
- Bachelor's Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).
- Minimum 7 years of experience in semiconductor assembly and packaging development.
- Knowledge of lead frame/substrate design and packing material development and qualification.
- Knowledge of material physics and properties related to lead frames, substrates, and packing materials.
- Knowledge of GD&T and material specification definition.
- Basic knowledge of semiconductor packaging, assembly, and test processes.
- Knowledge of material development, analysis, qualification, and reliability.
Skills: lead frame, substrate, packing material development, assembly rules, material physics, semiconductor assembly and packaging
This role has been open 10 days — well below the 66-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
66 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (196 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 317 | 9314 · 108 employers |
| Median days open | 31 d | 66 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: lead frame, substrate, packing material development, assembly rules, material physics, semiconductor assembly and packaging
Who's hiring in this category
- Infineon Technologies (this employer) · 27 open roles · median 31 d
- Micron Technology · 19 open roles · median 142 d
- Renesas Electronics · 19 open roles · median 24 d
- Intel Corporation · 12 open roles · median 148 d
- Monolithic Power Systems · 12 open roles · median 184 d
- onsemi · 7 open roles · median 64 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.