Originally posted 17 September 2026 by the employer — open 0 days.

About the role

What you'll do

Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR).
Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp.
Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making.
Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment.
Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification.
Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations.

BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience.
3+ years of experience in high-speed optical component or product development.
3+ years of experience in silicon photonics development.
3+ years of experience in semiconductor fabrication process development.
3+ years of experience in wafer-level assembly or packaging development.
3+ years of experience in test development and validation.

Experience in silicon photonics, optical transceivers, or semiconductor product development.
3+ years of semiconductor fab process experience.
3+ years of assembly, packaging, or manufacturing process experience.
Proven track record of leading cross-functional engineering teams and successfully transitioning products from development to high-volume manufacturing.

Skills: silicon photonics, optical interconnect, product development, manufacturing readiness, cross-functional leadership