Senior SI/PI Engineer (Location Hyderabad or Bangalore or Taiwan)
Kandou
Hyderabad, Telangana, India
18 days ago
Analog & Mixed-Signal Design
About the role
This role focuses on signal integrity and power integrity for semiconductor, package, PCB, and high-speed interconnect applications.
What you'll do
- Perform and lead theoretical and simulation-based SI analysis of PCB products, channels, test structures, and system implementations.
- Drive Signal and power delivery solutions for PCB and Package and evaluation platforms in collaboration with design teams.
- Work closely with circuit designers to ensure robust SI/PI implementation in silicon.
- Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges.
- Engage with customers and suppliers to define and validate hardware solutions including packages, PCB/backplane layouts, materials, interposers, and connectors.
- Evaluate and benchmark signaling schemes such as Chord signaling and PAM in terms of SI/PI performance, power, and implementation trade-offs.
What you'll need
- 12+ years of experience in the semiconductor industry, with a focus on signal and power integrity.
- Strong foundation in electromagnetics and system-level design, including material behavior across package, PCB, board, connector, and cable, as well as analog, power, and digital electronics.
- Proven experience solving significant SI problems through innovative connector, package, or cable design.
- Experience with high-speed interfaces including DDR5 and PCIe.
- Experience with Cadence board layout environments and SI/PI tools.
- Familiarity with lab measurements using VNA, spectrum analyzers, and high-speed oscilloscopes.
- Proficiency in Linux-based design environments and scripting for modeling and automation.
Nice to have
- Experience with DDR5 interface analysis, routing considerations, and channel optimization.
- Experience with PCIe channel design, equalization, and validation.
- Hands-on experience with Cadence Allegro, Sigrity, Clarity 3D, and related toolset.
- Exposure to advanced PCB Layout techniques for large server-based systems.
- PhD in electromagnetics-related areas such as Physics, Electrical Engineering, or Electronics Engineering.
Skills: signal and power integrity, electromagnetics, system-level design, multi-Gbps link solutions, package, PCB
Market context
This role has been open 139 days — well above the 91-day median for High-Speed IO/SerDes Design roles.
High-Speed IO/SerDes Design · Serdes Highspeed
|
Open roles in category
217
|
Median days open
91 d
|
Median salary
$185k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Kandou | All employers we track in this specialty (217 roles · 44 employers) |
|---|---|---|
| Open roles in category | 6 | 217 |
| Median days open | 98 d | 91 d (+7 d vs this employer) |
| Median salary (USD postings) | — | $185k |
Skills observed across this category: signal and power integrity, electromagnetics, system-level design, multi-Gbps link solutions, package, PCB
Who's hiring in this category
- AMD · 24 open roles · median 61 d
- Cadence Design Systems · 19 open roles · median 153 d
- Qualcomm · 17 open roles · median 74 d
- Synopsys · 16 open roles · median 53 d
- Broadcom · 11 open roles · median 142 d
- NVIDIA · 10 open roles · median 95 d
How we counted: 217 open High-Speed IO/SerDes Design (Serdes Highspeed) roles from 44 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Figures refresh nightly.