Senior Process Technician - Philippines - Mphil 3, Philippines
Originally posted 5 September 2026 by the employer — open 17 days.
PLP Fan-Out Wafer Level Packaging
About the role
This Senior Process Technician role supports the setup, operation, monitoring, troubleshooting, and continuous improvement of PLP Fan-Out Wafer Level Packaging (FOWLP) and Fan-In WLCSP manufacturing processes. The position provides technical support for process line sustaining, maintaining process integrity, and driving yield improvement activities.
What you'll do
- Support setup, operation, monitoring, and troubleshooting of FOWLP and WLCSP manufacturing processes.
- Provide technical support to process engineers and production teams.
- Ensure stable process performance and product quality.
- Maintain equipment uptime.
- Support qualification of new products and technologies.
- Support new process development and production ramp-up.
What you'll need
- Technical diploma or degree in Electronics Technology, Engineering, Semiconductor Manufacturing, or Mechatronics.
- 2 to 5 years' experience in the electronics or semiconductor manufacturing industry.
- Experience in Fan-In and Fan-out Wafer Level Packaging.
Skills: PLP Fan-Out Wafer Level Packaging, FOWLP, WLCSP, manufacturing processes, process line sustaining, yield improvement
This role has been open 17 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Microchip Technology | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 104 | 9417 · 108 employers |
| Median days open | 133 d | 68 d (+65 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: PLP Fan-Out Wafer Level Packaging, FOWLP, WLCSP, manufacturing processes, process line sustaining, yield improvement
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.