Senior Process and Integration Engineer - US-CA-Santa Rosa-Bldg 4, United States
$124,420 - $207,370 USD yearly
Originally posted 13 August 2026 by the employer.
Join Keysight's Microcircuit Assembly R&D team.
About the role
This senior, hands-on engineering role leads the development of innovative manufacturing processes and solves complex technical challenges within microcircuit assembly. You will drive New Product Introduction (NPI) initiatives from concept through production, working across materials, mechanical, electrical, and manufacturing disciplines.
What you'll do
- Serve as the subject matter expert (SME) and technical lead for microcircuit assembly processes, including epoxy dispensing, gold-gold thermosonic bonding (wire bonding, ball bonding, stud bumping, flip chip), automatic placement, soldering, silver sintering, and plasma cleaning.
- Act as the process team's technical lead on New Product Introduction (NPI) programs, representing process engineering in design reviews and program reviews.
- Lead Design for Manufacturability (DFM) reviews and formal risk assessments (e.g., FMEA) for new products and process changes.
- Influence product and package design decisions upstream by advising R&D and design teams on manufacturability, process capability, and assembly constraints.
- Lead process development projects end to end, defining scope and technical approach, planning resources and schedule, and driving execution to qualified, production-ready processes.
- Own qualification of new equipment, materials, and processes; drive continuous improvement in yield, capability, and efficiency across core assembly processes.
What you'll need
- Master's in Materials Science, Chemical Engineering, Mechanical Engineering, Manufacturing Engineering, Electrical Engineering, Physics, or a related engineering discipline; or a Bachelor's degree with significant directly related experience.
- 8+ years of relevant hands-on experience in microelectronics, microcircuit assembly, semiconductor packaging, or precision manufacturing process development.
- Demonstrated experience leading process development projects and/or serving as the technical point of contact on NPI programs.
- Hands-on depth in one or more of the following: epoxy dispensing, wire bonding, ball bonding, gold stud bump and flip chip bonding, automatic placement, silver sintering, or soldering.
- Proven track record applying DOE, statistical analysis, and root cause methodologies to resolve complex process and yield problems.
- Experience leading or substantially contributing to DFM reviews and formal risk assessments (e.g., FMEA).
- ITAR clearance (U.S. person status) required.
Nice to have
- Ph.D. in Materials Science, Chemical Engineering, or related engineering disciplines.
- Experience working in an NPI environment specific to microelectronics or hybrid microcircuit assembly.
- Advanced knowledge of high frequency interconnect and connectorization for RF applications.
- Advanced knowledge of DFM, DOE, statistical process control (SPC), and root cause analysis methodologies.
- Proficiency with statistical analysis tools such as JMP or Minitab.
- Proficiency with CAD software such as Siemens NX or PTC Creo.
Skills: microcircuit assembly, epoxy dispensing, wire bonding, flip chip, silver sintering, DFM, FMEA
This role has been open 64 days — slightly above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
205
|
Median days open
59 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Keysight Technologies | All employers we track in this specialty (205 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 205 |
| Open roles in the wider Process, Fab & Equipment family | 130 | 9862 · 109 employers |
| Median days open | 106 d | 59 d (+47 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: microcircuit assembly, epoxy dispensing, wire bonding, flip chip, silver sintering, DFM
Who's hiring in this category
- Renesas Electronics · 27 open roles · median 32 d
- Infineon Technologies · 24 open roles · median 47 d
- Micron Technology · 23 open roles · median 130 d
- onsemi · 13 open roles · median 25 d
- Monolithic Power Systems · 11 open roles · median 211 d
- Intel Corporation · 9 open roles · median 102 d
How we counted: 205 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.