Senior Principal Engineer, Global Product Management - Advanced Packaging
Originally posted 15 September 2026 by the employer — open 2 days.
About the role
This role involves shaping technologies that enable semiconductor devices within ASM's Advanced Packaging business. The position focuses on driving innovations in advanced packaging, heterogeneous integration, chiplet architectures, and interconnect solutions.
What you'll do
- Lead advanced packaging product platforms from concept through commercialization and manufacturing.
- Define and maintain product roadmaps for emerging advanced packaging applications.
- Own product requirements, configurations, and platform options.
- Develop strategic relationships with semiconductor manufacturers, foundries, and OSATs.
- Develop and manage market and product requirement documents.
- Drive market assessments, TAM analysis, customer segmentation, competitive benchmarking, and go-to-market strategies.
What you'll need
- 5-10 years of experience in product management, technical marketing, applications engineering, process engineering, or business development within the semiconductor industry.
- Master's or PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, Mechanical Engineering, or a related technical field.
- Strong understanding of advanced packaging technologies, including heterogeneous integration, chiplet architectures, hybrid bonding, wafer-level packaging (WLP), panel-level packaging (PLP), 2.5D/3D integration, TSVs, redistribution layers (RDL), and advanced interconnect technologies.
- Knowledge of semiconductor manufacturing processes and equipment, particularly deposition, surface preparation, thermal processing, or related front-end and back-end technologies.
- Experience working with semiconductor manufacturers, foundries, OSATs, or advanced packaging organizations.
- Willingness and ability to travel globally (up to 25-35%).
Nice to have
- Familiarity with hybrid bonding, dielectric and metallization processes, wafer-to-wafer and die-to-wafer integration, or related advanced packaging process technologies.
- Experience with semiconductor capital equipment product management, strategic marketing, or new product introduction.
This role has been open 2 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 249 | 9358 · 108 employers |
| Median days open | 23 d | 53 d (−30 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.