Senior Package Reliability Engineer - San Jose, California, United States
$166,900 - $240,000 USD yearly
Originally posted 16 July 2026 by the employer.
Characterize and qualify advanced 2.5D/3D semiconductor packages through thermal and thermomechanical FEM modeling.
About the role
This role is responsible for characterizing and qualifying advanced 2.5D/3D semiconductor packages. You will partner with package development, assembly, and manufacturing teams to select packaging materials based on thermal and thermomechanical characterization.
What you'll do
- Partner with package development and assembly teams to select packaging materials meeting product thermomechanical reliability requirements. - Develop and maintain advanced semiconductor package thermal and thermomechanical finite element models using commercial software such as Ansys or Abaqus. - Define, execute, and interpret package coplanarity, warpage, and second level reliability data collection strategies to calibrate thermal and thermomechanical FEM models. - Lead package reliability evaluations to validate package robustness against standards including JEDEC, MIL-STD, IPC, and AEC using test-chips and products. - Perform reliability lifetime prediction modeling from stress test and field data, and develop package DFMEA/FMEAs. - Analyze FPGA use conditions and develop customer reports and communications addressing package thermal and thermomechanical concerns.
What you'll need
- Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field with 8+ years of experience in semiconductor package thermal and thermomechanical analysis. - 8+ years of experience using thermal and thermomechanical simulation tools (such as Ansys, Abaqus, COMSOL, or equivalent) to model warpage, coplanarity, stress, and deformation. - 8+ years of experience developing, analyzing, and validating advanced semiconductor packaging technologies, including 2.5D, 3D, and heterogeneous integration packages. - 3+ years of experience applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to semiconductor packaging and product reliability assessments. - 3+ years of experience developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.
Nice to have
- Understanding of thermal, mechanical, and thermomechanical characteristics of advanced 2.5D/3D flip-chip packages. - Experience correlating thermomechanical simulations with package dynamic warpage and surface mount system level assembly behavior. - Experience developing customer-facing collaterals for packaging risk assessments.
Skills: package reliability, 2.5D/3D semiconductor packages, thermomechanical, JEDEC, FEM models
This role has been open 96 days — well above the 55-day median for Reliability Engineering roles.
Reliability Engineering · Reliability Engineering
|
Open roles in category
432
|
Median days open
55 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Altera | All employers we track in this specialty (432 roles · 71 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 432 |
| Open roles in the wider Process, Fab & Equipment family | 8 | 10037 · 107 employers |
| Median days open | 96 d | 55 d (+41 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Skills observed across this category: package reliability, 2.5D/3D semiconductor packages, thermomechanical, JEDEC, FEM models
Who's hiring in this category
- Micron Technology · 78 open roles · median 135 d
- Infineon Technologies · 32 open roles · median 44 d
- Renesas Electronics · 22 open roles · median 41 d
- Analog Devices · 18 open roles · median 56 d
- STMicroelectronics · 18 open roles · median 27 d
- Applied Materials · 17 open roles · median 75 d
How we counted: 432 open Reliability Engineering (Reliability Engineering) roles from 71 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.