Failure Analysis Technician (Night Shift -B) - Sherman, TX, United States
Originally posted 19 October 2026 by the employer.
Operate Helios Dual-Beam Focused Ion Beam (DBFIB) systems and perform high-resolution TEM lamella preparation for semiconductor and photonic devices.
About the role
A Failure Analysis Technician is responsible for performing advanced physical failure analysis of semiconductor and photonic devices using focused ion beam (FIB), dual-beam FIB (DBFIB), scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and transmission electron microscopy (TEM) techniques. The role operates on a night shift schedule in Sherman, TX, supporting root-cause investigations, product reliability, and manufacturing yield improvement.
What you'll do
- Operate a Helios Dual-Beam Focused Ion Beam (DBFIB) system to perform precision cross-sectioning, defect localization, delayering, circuit editing support, and structural characterization. - Prepare high-quality TEM lamella specimens using in-situ and ex-situ lift-out techniques, including thinning and final polishing for high-resolution TEM analysis. - Perform SEM imaging and EDS elemental analysis to characterize materials, contamination, defects, interfaces, and failure mechanisms. - Operate a Transmission Electron Microscope (TEM) to evaluate device structures, material interfaces, process defects, and failure sites. - Perform sample preparation activities including cleaving, polishing, mounting, and coating to support advanced analytical investigations. - Support root-cause investigations by analyzing microscopy results and generating technical reports with images, measurements, and conclusions.
What you'll need
- Associate Degree in Electronics, Materials Science, Engineering Technology, Physics, Chemistry, Microscopy, or a related technical field with 2+ years of relevant experience, or 4+ years of directly applicable experience in semiconductor failure analysis, microscopy, materials characterization, or a related laboratory environment. - Hands-on experience operating Focused Ion Beam (FIB) or Dual-Beam FIB (DBFIB) systems. - Ability to interpret SEM, TEM, EDS, and FIB-generated data and communicate observations clearly. - Strong mechanical aptitude and manual dexterity to handle delicate samples and manipulate sub-micron features using tweezers and precision tools. - Proficiency with Microsoft Office applications and technical report generation. - Ability to work in a Class 10,000 cleanroom wearing required attire and personal protective equipment around chemicals such as IPA and acetone.
Nice to have
- Experience with TEM lamella preparation using in-situ lift-out techniques. - Experience operating Scanning Electron Microscopes (SEM) and performing EDS elemental analysis. - Experience operating or supporting Transmission Electron Microscopes (TEM). - Working knowledge of semiconductor device structures, thin-film materials, metallization systems, and failure mechanisms. - Experience with image processing and annotation software such as Photoshop or ImageJ. - Experience working in cleanroom, laboratory, or semiconductor manufacturing environments.
This role has been open 0 days — well below the 55-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
190
|
Median days open
55 d
|
Median salary
$116k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Coherent Corp | All employers we track in this specialty (190 roles · 39 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 190 |
| Open roles in the wider Process, Fab & Equipment family | 152 | 10037 · 107 employers |
| Median days open | 106 d | 55 d (+51 d vs this employer) |
| Median salary (USD postings) | — | $116k |
Who's hiring in this category
- Micron Technology · 34 open roles · median 70 d
- GlobalFoundries · 14 open roles · median 28 d
- Lam Research · 14 open roles · median 44 d
- Infineon Technologies · 13 open roles · median 49 d
- Intel Corporation · 10 open roles · median 47 d
- STMicroelectronics · 10 open roles · median 48 d
How we counted: 190 open Failure Analysis Engineering (Failure Analysis) roles from 39 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.