Senior Heterogenous Integration Process Engineer - Albany, United States
$123,806 - $174,945 USD yearly
Originally posted 27 July 2026 by the employer.
About the role
This role involves leading the development of innovative process and equipment solutions for advanced heterogeneous integration and 3D device integration technologies. This position focuses on technologies like fusion bonding, hybrid bonding, wafer-to-wafer (W2W) and chip-to-wafer (C2W) integration, wafer thinning, and TSV technologies.
What you'll do
- Lead R&D programs in advanced 3DI technologies, including C2W, D2W, and wafer bonding.
- Define technical strategy and align R&D activities with business objectives.
- Collaborate with global teams, customers, and joint development partners.
- Conduct fundamental research and develop innovative processes and hardware solutions.
- Evaluate technology feasibility through modeling, simulation, and experimentation.
- Drive technology pathfinding for heterogeneous and 3D device integration.
What you'll need
- Ph.D. in Materials Science, Mechanical, Chemical, Electrical Engineering, Physics, Chemistry, Nanotechnology, or a related field.
- 5+ years of semiconductor R&D experience.
- Strong expertise in advanced packaging, heterogeneous integration, and/or 3D device integration.
- Hands-on experience in wafer bonding, process integration, or related semiconductor technologies.
- Strong project management and organizational capabilities.
- Demonstrated leadership in cross-functional technical programs.
Skills: heterogeneous integration, 3D device integration, wafer bonding, C2W, TSV
This role has been open 66 days — slightly above the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
308
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Tokyo Electron | All employers we track in this specialty (308 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 308 |
| Open roles in the wider Process, Fab & Equipment family | 22 | 9611 · 109 employers |
| Median days open | 66 d | 58 d (+8 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: heterogeneous integration, 3D device integration, wafer bonding, C2W, TSV
Who's hiring in this category
- KLA Corporation · 51 open roles · median 113 d
- Micron Technology · 37 open roles · median 36 d
- Renesas Electronics · 19 open roles · median 32 d
- Infineon Technologies · 17 open roles · median 50 d
- onsemi · 15 open roles · median 23 d
- Intel Corporation · 13 open roles · median 50 d
How we counted: 308 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 2 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.