Senior Engineer II, Process Engineering (Advanced Packaging) - Singapore
ASM International
Singapore
20 days ago
Packaging & Advanced Integration
Originally posted 15 September 2026 by the employer — open 4 days.
About the role
What you'll do
- Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
- Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
- Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
- Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
- Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
- Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
What you'll need
- Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
- Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps.
- Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
- Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
- Knowledge of electrical characterization techniques for CMOS devices.
- Ability to manage complex process development projects, including schedules, budgets, and personnel.
Market context
This role has been open 4 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 250 | 9328 · 108 employers |
| Median days open | 23 d | 53 d (−30 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology · 36 open roles · median 27 d
- Renesas Electronics · 21 open roles · median 19 d
- Infineon Technologies · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.