Senior Engineer/ Engineer – Package Silicon Integration Engineer
Originally posted 2 September 2026 by the employer.
About the role
This role focuses on developing and executing plans to integrate new silicon technologies with new package platforms for memory applications.
What you'll do
- Understand silicon and package technology roadmaps and identify integration solutions.
- Develop and execute plans to integrate new silicon technologies with new package platforms, focusing on CPI issues.
- Contribute to virtual prototyping and artificial intelligence workflows for evaluating new materials, structures, and integration schemes.
- Apply working knowledge of multi-physics simulation (mechanical, thermal, or electrical) to support CPI risk assessment.
- Define mechanical characterization architectures to capture CPI behaviors and validate integration assumptions.
- Collaborate with silicon and package developers to identify solutions and implement design rules.
What you'll need
- Understanding of IC package development with exposure to CPI concepts, test vehicle development, front-end fab processes, or BEOL integration.
- Ability to define and execute test vehicle strategies.
- Familiarity with virtual prototyping concepts and the use of simulation to reduce physical build dependency.
- Familiarity with at least one simulation or modeling domain: Mechanical stress / thermo-mechanical analysis (FEA), Thermal simulation, or Electrical / signal integrity / power integrity modeling.
- Background in fab metallization, BEOL integration, or front-end fab interactions.
- Experience with cross-functional project coordination and technical collaboration.
Nice to have
- Experience with AI/ML tools for data visualization/automation.
- Knowledge of semiconductor fabrication, assembly & test processes.
Skills: package technology roadmaps, integration solutions, virtual prototyping, multi-physics simulation, design rules
More semiconductor jobs: Micron Technology jobs · Advanced packaging jobs · India jobs
This role has been open 64 days — slightly above the 55-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
75
|
Median days open
55 d
|
Category median salary (all employers)
$176k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (75 roles · 26 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 75 |
| Median days open | 188 d | 55 d (+133 d vs this employer) |
| Median salary (USD postings) | — | $176k |
Skills observed across this category: package technology roadmaps, integration solutions, virtual prototyping, multi-physics simulation, design rules
Who's hiring in this category
- AMD · 14 open roles · median 25 d
- Micron Technology (this employer) · 9 open roles · median 188 d
- Marvell Technology · 6 open roles · median 33 d
- NVIDIA · 6 open roles · median 58 d
- Qualcomm · 4 open roles · median 100 d
- Broadcom · 3 open roles · median 96 d
How we counted: 75 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 26 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.