Senior Engineer Development Die Attach - Melaka
Originally posted 4 September 2026 by the employer.
About the role
As a Senior Engineer Development Die Attach, you will perform process development activities in the Research & Development team. This role involves developing new process technologies and enhancing process capability.
What you'll do
- Perform process development activities, including parameter scouting, optimization, verification, and process freeze.
- Lead technical handover and knowledge transfer activities to Operations.
- Develop and maintain documentation such as Process Specifications, PFMEA, DFMEA, OJTI, T32 (P), and PDR.
- Liaise with suppliers on continuous improvement initiatives and support verification and qualification of new tooling, equipment, and materials.
- Participate in task forces and problem-solving teams, applying statistical and analytical tools such as SPC, APC, DOE, 8D, FMEA, and DFMEA.
- Provide technical guidance and mentorship to engineers and project team members.
What you'll need
- Master's or Bachelor's Degree in Engineering or a related field.
- Minimum 3 years of experience in the semiconductor manufacturing industry.
- Hands-on knowledge and skills in assembly processes.
- Knowledge of analytical equipment and characterization techniques.
- Proficiency in statistical data analysis and Design of Experiments (DOE).
- Proficiency in Microsoft Office applications.
This role has been open 19 days — well below the 56-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
297
|
Median days open
56 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (297 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 297 |
| Open roles in the wider Process, Fab & Equipment family | 318 | 9479 · 109 employers |
| Median days open | 43 d | 56 d (−13 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 104 d
- Micron Technology · 36 open roles · median 34 d
- Infineon Technologies (this employer) · 19 open roles · median 43 d
- Renesas Electronics · 19 open roles · median 23 d
- onsemi · 15 open roles · median 14 d
- Lumilens · 13 open roles · median 47 d
How we counted: 297 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.