Senior Engineer Development Die Attach - Melaka
Packaging & Advanced Integration
Originally posted 1 September 2026 by the employer.
About the role
This role focuses on die attach process development activities within the Research & Development team.
What you'll do
- Perform process development activities including parameter scouting, optimization, verification, and freeze to meet project targets.
- Manage technical handover, knowledge transfer, and support prototype and development sample builds.
- Prepare and maintain process-related documentation such as Process Specifications, PFMEA, DFMEA, and Assembly Design Rules.
- Collaborate with suppliers on continuous improvement initiatives and qualify new tooling, equipment, and materials.
- Participate in task forces and problem-solving activities using statistical and analytical tools like SPC, APC, DOE, 8D, and FMEA.
- Identify, develop, and improve process technologies and capabilities to meet business and product requirements.
What you'll need
- Master's or Bachelor's Degree in Engineering or a related discipline.
- Minimum 3 years of working experience in the semiconductor manufacturing industry.
- Hands-on knowledge of assembly processes and relevant industry practices.
- Knowledge of analytical equipment and statistical data analysis, including Design of Experiments (DOE).
- Proficient in Microsoft Office applications.
Market context
This role has been open 23 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Infineon Technologies | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 318 | 9525 · 109 employers |
| Median days open | 44 d | 58 d (−14 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies (this employer) · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.