Senior Director of Packaging Technology - Plano, TX, United States
Originally posted 17 July 2026 by the employer.
About the role
This role leads global teams in the development and integration of packaging solutions for semiconductor products. Focus areas include package architectures, assembly processes, thermal and mechanical reliability, and taking analog and power products from concept through qualification and high-volume production.
What you'll do
- Lead the design, development, and qualification of packaging solutions including flip-chip, chip embedding, wafer-level packaging (WLP/FOWLP), panel-level packaging, SiP, MCM, power modules, and leaded packages. - Define package architecture, layout reviews, stack-up definition, material selection, and interconnect strategy based on electrical, thermal, mechanical, reliability, and cost requirements. - Guide simulations and analysis covering thermal, mechanical, electrical performance, and design for manufacturability (DFM). - Develop assembly flows and process requirements for captive manufacturing plants and OSAT partners. - Direct package qualification programs including DOE planning, failure analysis, reliability testing, and resolution of issues during NPI prototype builds and production ramp. - Partner with corporate leadership to define multi-year capability and capacity roadmaps aligned with product growth and organizational strategy.
What you'll need
- MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field. - 15+ years of direct experience in semiconductor packaging or advanced electronics packaging. - 10+ years of global team management and leadership experience. - Deep understanding of thermal, mechanical, and electrical interactions in package design and chip-package interaction (CPI). - Direct experience working with OSATs, substrate vendors, assembly houses, and packaging qualification standards. - Demonstrated ability to troubleshoot packaging failures and drive root cause and corrective action.
Nice to have
- Fluency in Mandarin.
This role has been open 93 days — well above the 65-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
294
|
Median days open
65 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Diodes Incorporated | All employers we track in this specialty (294 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 294 |
| Open roles in the wider Process, Fab & Equipment family | 17 | 10042 · 107 employers |
| Median days open | 93 d | 65 d (+28 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 132 d
- Micron Technology · 39 open roles · median 39 d
- Intel Corporation · 17 open roles · median 64 d
- Renesas Electronics · 15 open roles · median 51 d
- GlobalFoundries · 14 open roles · median 64 d
- Lumilens · 13 open roles · median 75 d
How we counted: 294 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.