Senior Design Engineer/Principle Design Engineer - Seremban, Malaysia
Originally posted 5 October 2026 by the employer.
About the role
This role involves the design and development of new packing methods, footprints, carrier tapes, and box designs for IC/discrete packages, addressing gaps between design requirements and supplier capabilities.
What you'll do
- Identify technical risks and propose mitigation using design tools such as Design FMEA and simulations.
- Drive sound solutions for packing method, footprint, carrier tape, and box designs.
- Own the packing method, footprint, carrier tape, and box design process.
- Ensure effective implementation of the design process throughout the development life cycle.
- Maintain design rules for footprint, carrier tape, and box that reflect assembly and supplier capabilities.
- Address customers’ physical issues related to our packages, including T&R, SMT, and solderability.
What you'll need
- Degree in engineering disciplines or materials science.
- Knowledge of IC/discrete package design.
- Experience with design tools such as simulation, Design FMEA, and CAD.
- Design experience of solder footprint.
- Strong customer focus, proactive, and able to work with minimal supervision.
- Good interpersonal and presentation skills in cross-site and cross-functional teams.
- Good command of written and spoken English.
Nice to have
- Master degree or higher.
- Experience in handling customer interactions.
- Mandarin language proficiency.
Skills: IC/discrete package design, packing method, footprint design, carrier tape, Design FMEA
This role has been open 22 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
214
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Nexperia | All employers we track in this specialty (214 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 214 |
| Open roles in the wider Process, Fab & Equipment family | 107 | 10125 · 107 employers |
| Median days open | 42 d | 58 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: IC/discrete package design, packing method, footprint design, carrier tape, Design FMEA
Who's hiring in this category
- Renesas Electronics · 30 open roles · median 39 d
- Infineon Technologies · 25 open roles · median 43 d
- Micron Technology · 21 open roles · median 42 d
- onsemi · 17 open roles · median 32 d
- Intel Corporation · 11 open roles · median 111 d
- Monolithic Power Systems · 11 open roles · median 221 d
How we counted: 214 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.