Semiconductor Package Electrical Engineer - Hyderabad - Phoenix Aquila, India
Packaging & Advanced Integration
Originally posted 29 September 2026 by the employer.
About the role
This role involves the electrical and physical design of high-speed interfaces in semiconductor packages, focusing on electrical modeling, simulation, and characterization.
What you'll do
- Work on electrical and physical design of high-speed interfaces in packages.
- Work on electrical model extraction and validation of package interconnects with circuit design team and IP vendor.
- Perform electrical modeling, simulation, and characterization of high-speed interfaces.
- Develop and execute test plans to validate package electrical models with measurements.
- Work with product engineering and system engineering for package correlation and validation.
- Translate engineering problems into scalable Artificial Intelligence and automation solutions.
What you'll need
- MTech in Electrical Engineering with strong emphasis in Electromagnetics, Microwave, Antenna Theory and RF Circuits.
- Familiarity with Ansys, Siemens or Cadence tools for frequency domain modeling.
- Familiarity with Frequency domain analysis.
- Familiarity with transient time domain analysis.
Market context
This role has been open 0 days — well below the 74-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
203
|
Median days open
74 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (203 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 203 |
| Open roles in the wider Process, Fab & Equipment family | 1466 | 9573 · 108 employers |
| Median days open | 146 d | 74 d (+72 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 40 d
- Renesas Electronics · 23 open roles · median 32 d
- Micron Technology (this employer) · 17 open roles · median 151 d
- Intel Corporation · 13 open roles · median 157 d
- Monolithic Power Systems · 12 open roles · median 193 d
- onsemi · 11 open roles · median 19 d
How we counted: 203 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
Hyderabad - Phoenix Aquila, India
On-site
Full-time
6 days ago