Semiconductor Assembly Process Development Engineer - Nakatsu, Japan
Originally posted 25 September 2026 by the employer.
About the role
This role involves technology development in semiconductor back-end processes, including assembly, packaging, and testing. You will contribute to the development of advanced technologies such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array).
What you'll do
- Develop and evaluate advanced packaging technologies, including FCCSP and FCBGA.
- Develop and improve materials and assembly processes like molding, strip grinding, ball mounting, marking, and package sawing.
- Support production line setup and transition to mass production.
- Drive process quality improvements and yield enhancement activities.
What you'll need
- Minimum of 5 years of experience in technology development for semiconductor back-end processes (assembly and packaging).
- At least 5 years of experience in technology development in one or more of the following processes: Molding, Strip Grinding, or Package Sawing.
- Hands-on experience in process improvement, quality control, and equipment introduction/implementation.
- Bachelor’s degree or above in Mechanical Engineering, Materials Science, Electronics, Chemistry, or a related discipline.
- Business-level proficiency in Japanese.
- Approximately TOEIC 700 level English proficiency.
Skills: Flip Chip, System-in-Package, FCCSP, FCBGA, assembly processes, molding
This role has been open 2 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (300 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 18 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9460 · 108 employers |
| Median days open | 23 d | 58 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: Flip Chip, System-in-Package, FCCSP, FCBGA, assembly processes, molding
Who's hiring in this category
- KLA Corporation · 50 open roles · median 107 d
- Micron Technology · 35 open roles · median 33 d
- Infineon Technologies · 18 open roles · median 46 d
- Renesas Electronics (this employer) · 18 open roles · median 22 d
- Intel Corporation · 15 open roles · median 83 d
- onsemi · 15 open roles · median 18 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 27 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.