Semiconductor Advanced Packaging Process Engineering Intern - US-CA-Santa Rosa-Bldg 2, United States
Originally posted 24 September 2026 by the employer.
About the role
As a Semiconductor Advanced Packaging Process Engineering Intern, you will contribute to the development and optimization of heterogeneous integration and advanced packaging technologies. This role involves supporting the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture advanced System-in-Package (SiP) products and interposer technologies within the Keysight Labs/High Frequency Technology Center.
What you'll do
- Assist with planning, execution, and documentation of engineering experiments to evaluate process, material, and equipment performance.
- Collect, analyze, and interpret process, metrology, and electrical test data to identify trends and improvement opportunities.
- Work directly with advanced semiconductor assembly equipment, including thermocompression bonding (TCB), pick-and-place, and inspection.
- Support process development activities focused on improving assembly cycle time, throughput, yield, and process robustness.
- Assist in failure analysis, defect characterization, and troubleshooting of assembly-related process issues.
- Develop and maintain technical documentation, including experiment plans, procedures, reports, and presentations.
What you'll need
- Graduate student pursuing an M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, Manufacturing Engineering, or a related technical field.
- Academic or research experience in semiconductor processing, materials characterization, microfabrication, device fabrication, advanced packaging, or manufacturing engineering.
- Understanding of semiconductor manufacturing processes, materials, and device fundamentals.
- Strong analytical, problem-solving, and data interpretation skills.
- Excellent written and verbal communication skills and the ability to work effectively in a collaborative team environment.
- Demonstrated hands-on laboratory, manufacturing, research, or engineering project experience.
Nice to have
- Hands-on laboratory or research experience with semiconductor fabrication processes such as lithography, deposition, etch, electroplating, CMP, metrology, defect inspection, advanced packaging, or semiconductor assembly technologies.
- Experience with statistical analysis, design of experiments (DOE), process characterization, or data analysis tools such as JMP, MATLAB, Python.
- Experience with manufacturing equipment, automation, robotics, precision motion systems, or machine vision systems.
- Experience presenting technical results through reports, publications, conference presentations, or research reviews.
- Experience working in cleanroom, laboratory, or manufacturing environments.
- Exposure to advanced packaging, flip-chip assembly, thermocompression bonding, or electronic packaging technologies.
This role has been open 2 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Keysight Technologies | All employers we track in this specialty (300 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 108 | 9460 · 108 employers |
| Median days open | 40 d | 58 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 107 d
- Micron Technology · 35 open roles · median 33 d
- Infineon Technologies · 18 open roles · median 46 d
- Renesas Electronics · 18 open roles · median 22 d
- Intel Corporation · 15 open roles · median 83 d
- onsemi · 15 open roles · median 18 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 27 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.