Semiconductor Advanced Packaging Process Engineering Intern - US-CA-Santa Rosa-Bldg 2, United States
$43 - $47 USD hourly
Originally posted 24 September 2026 by the employer.
Support assembly process characterization for System-in-Package (SiP) and interposer technologies using thermocompression bonding (TCB) equipment.
About the role
As a Semiconductor Advanced Packaging Process Engineering Intern within the Keysight Labs/High Frequency Technology Center, you will support the development, characterization, and continuous improvement of semiconductor assembly processes used to manufacture System-in-Package (SiP) products and interposer technologies.
What you'll do
- Assist with the planning, execution, and documentation of engineering experiments to evaluate process, material, and equipment performance. - Work directly with semiconductor assembly equipment, including thermocompression bonding (TCB), pick-and-place, inspection, and supporting process tools. - Collect, analyze, and interpret process, metrology, and electrical test data to identify trends and improvement opportunities. - Assist in failure analysis, defect characterization, and troubleshooting of assembly-related process issues. - Support process development activities focused on improving assembly cycle time, throughput, yield, and process robustness. - Follow established safety, quality, and cleanroom operating procedures while working in a semiconductor manufacturing environment.
What you'll need
- Currently enrolled graduate student pursuing an M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Physics, Manufacturing Engineering, or a related technical field. - Academic or research experience in semiconductor processing, materials characterization, microfabrication, device fabrication, advanced packaging, manufacturing engineering, or related areas. - Understanding of semiconductor manufacturing processes, materials, and device fundamentals. - Demonstrated hands-on laboratory, manufacturing, research, or engineering project experience. - U.S. person status (U.S. citizen, lawful permanent resident, or protected individual) under U.S. export control regulations.
Nice to have
- Hands-on laboratory or research experience with semiconductor fabrication processes such as lithography, deposition, etch, electroplating, CMP, metrology, defect inspection, advanced packaging, or semiconductor assembly technologies. - Experience with statistical analysis, design of experiments (DOE), process characterization, or data analysis tools such as JMP, MATLAB, Python, or equivalent. - Experience with manufacturing equipment, automation, robotics, precision motion systems, or machine vision systems. - Exposure to advanced packaging, flip-chip assembly, thermocompression bonding, or electronic packaging technologies. - Experience working in cleanroom, laboratory, or manufacturing environments.
This role has been open 32 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Keysight Technologies | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 122 | 10147 · 107 employers |
| Median days open | 51 d | 63 d (−12 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.