Robotics Systems Eng II, Robotics Delivery & Packaging Innovations (RDPI) Technology Deployment
Originally posted 16 September 2026 by the employer — open 2 days.
About the role
This role involves deploying industrial robotics within Amazon's fulfillment network across North America. The position focuses on the tactical deployment of large-scale industrial automation technologies at customer fulfillment sites.
What you'll do
- Oversee large-scale project planning, installation, and launch of industrial automation technologies.
- Manage multiple simultaneous deployments of a single technology or multi-technology deployments within a single site.
- Collaborate with cross-functional partners to convert technical requirements into refined deployment execution documents.
- Independently resolve difficult technical problems during deployment, making appropriate trade-offs.
- Create and improve standard work documents and operational guidebooks.
- Develop subject matter expertise in one or more deployment domains.
What you'll need
- Experience with complex electro-mechanical and network systems.
- Experience with large scale installations and system troubleshooting.
- Ability to manage tactical deployment of large scale industrial automation technologies.
- Experience driving continuous improvement ideas into the deployment cycle time.
- Ability to provide technical oversight on installation of Amazon-designed automation equipment.
- Willingness to travel 75% or more across North America.
This role has been open 1 day — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Amazon | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 6 | 9358 · 108 employers |
| Median days open | 1 d | 53 d (−52 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.