RF Package Design Engineer, Senior Staff
$191,800 - $287,800 USD yearly
Originally posted 13 October 2026 by the employer.
This role focuses on Electrical Characterization of RF Packages for 6G Infrastructure and 6G consumer devices.
About the role
This senior leadership position is responsible for leading RF Package Design, focusing on electrical characterization of RF Packages. The work involves RF-IC Package and system in package for products used in 6G Infrastructure and 6G consumer devices.
What you'll do
- Work with Package designer and RF-IC block owners to optimize bump/ball assignments and perform early analysis.
- Establish best known methods to extract 3D parasitic models for RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).
- Guide the team in troubleshooting RF problems such as DC convergence, leakage, and isolation in testbench.
- Define methodologies for RF simulations for various Package types, frequency bands, and IP requirements.
- Work with the Advanced Technology team to develop robust future RF PKG technology.
- Recruit and lead a team of engineers, providing technical mentoring to junior members.
What you'll need
- Master's degree in Science, Engineering, or a related field.
- 10 years of RF Package/PCB design experience.
- Solid understanding and experience in Electromagnetics, Transmission line theory, and Crosstalk.
- Proficiency in field solvers such as Ansys HFSS, Q3D, and PSI.
- Proficiency in simulation tools such as ADS and Hspice.
- Good knowledge of design tools such as Cadence Allegro/APD/Sip or Mentor Xpedition.
Nice to have
- Ability to optimize RF design & analysis flow and automate it.
- Thorough understanding of Packaging technologies and industry landscape in RF Packaging.
- Familiarity with Analog & RF-IC design.
- Proficiency in MatLab.
- Experience in programming language (c/c++) or scripting language (Perl/Python).
- People Management experience.
Skills: RF Package Design, 3D parasitic models, RF packages, Electromagnetics, Transmission line theory
This role has been open 0 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
61 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Qualcomm | All employers we track in this specialty (199 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 49 | 9855 · 109 employers |
| Median days open | 53 d | 61 d (−8 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: RF Package Design, 3D parasitic models, RF packages, Electromagnetics, Transmission line theory
Who's hiring in this category
- Infineon Technologies · 25 open roles · median 49 d
- Renesas Electronics · 23 open roles · median 44 d
- Micron Technology · 22 open roles · median 134 d
- onsemi · 12 open roles · median 25 d
- Monolithic Power Systems · 11 open roles · median 208 d
- Intel Corporation · 9 open roles · median 99 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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