About the role
This role involves extracting and optimizing compact (SPICE) models for semiconductor devices. You will collaborate with design and process technology teams.
What you'll do
- Extract compact models for advanced semiconductor devices (HBT/BJT, RF CMOS, RF Passives, GaN)
- Partner with designers and technologists to deploy modeling solutions for RF circuit topologies
- Develop innovative model formulations for emerging device technologies
- Develop AI/ML-enhanced models and parameter extraction methodologies
- Validate models through comprehensive measurement and analysis
What you'll need
- Ph.D./Masters in Electrical Engineering or related field
- 5+ years in compact (SPICE) RF modeling for HBT/BJT and CMOS
Nice to have
- Expert-level experience with RF characterization, modeling, and circuit-level validation for s-parameters, noise figure, linearity, IMP3/IP3, and harmonic distortion
- Strong understanding of RF test-structures, layouts, and calibration/de-embedding techniques
- Experience with models (BSIM, MEXTRAM, HICUM, MVSG-GAN, ASM) and parameter extraction tools (ICCAP, BSIMPROPLUS, MBP, etc.)
- Deep understanding of semiconductor physics and circuit analysis
- Proficiency in EDA tools (Cadence), SPICE simulators (Spectre) and Verilog-A
- Programming skills in MATLAB/Python
- Data analysis skills with AI/ML expertise and TCAD experience
Skills: compact models, semiconductor devices, HBT/BJT, RF CMOS, GaN, SPICE modeling, RF characterization, semiconductor physics
More semiconductor jobs: Texas Instruments jobs · Device engineer jobs · India jobs
This role has been open 43 days — well below the 53-day median for Device Engineering roles.
Device Engineering · Device Physics
|
Open roles in category
140
|
Median days open
53 d
|
Category median salary (all employers)
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (140 roles · 37 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 140 |
| Median days open | 121 d | 53 d (+68 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: compact models, semiconductor devices, HBT/BJT, RF CMOS, GaN, SPICE modeling
Who's hiring in this category
- GlobalFoundries · 18 open roles · median 67 d
- Micron Technology · 17 open roles · median 105 d
- Renesas Electronics · 14 open roles · median 49 d
- SanDisk · 12 open roles · median 6 d
- Intel Corporation · 9 open roles · median 37 d
- onsemi · 9 open roles · median 43 d
How we counted: 140 open Device Engineering (Device Physics) roles from 37 employers tracked in the SemiconductorJobs index, counted 5 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.