Regional Development Applications Engineer - Shanghai, China
Originally posted 29 September 2026 by the employer.
About the role
This role focuses on providing high-level applications support for complex optical overlay measurement systems within the Semiconductor Products and Customers (Semi PC) business unit, specifically the Optical Metrology Division (OMD).
What you'll do
- Provide high-level applications support for complex Overlay measurement systems to internal teams and external customer engineers.
- Manage in-house customer demonstrations and head-to-head (H2H) activities at customer sites.
- Develop use cases and design experiments to characterize tool/subcomponent performance and demonstrate product value during alpha testing, beta testing, and pilot tool support.
- Develop recipes to model complex optical applications and optimize tool performance.
- Provide escalation support to onsite field service engineers, leading and coordinating remote/local troubleshooting.
What you'll need
- MS or PhD in Physics, or related engineering fields such as optics, materials science, and microelectronics.
- 0 years of related work experience for Master's Level Degree or PhD's Level Degree.
- Excellent problem-solving and analytical skills.
- Proficient in the English language and able to work effectively with different cultures.
Nice to have
- Matlab/Python experience.
This role has been open 0 days — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
59 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (295 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 52 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 440 | 9573 · 108 employers |
| Median days open | 109 d | 59 d (+50 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation (this employer) · 50 open roles · median 109 d
- Micron Technology · 33 open roles · median 33 d
- Infineon Technologies · 18 open roles · median 48 d
- Renesas Electronics · 18 open roles · median 24 d
- onsemi · 15 open roles · median 20 d
- Lumilens · 13 open roles · median 53 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.