Regional Development Applications Engineer - Shanghai, China
Originally posted 29 September 2026 by the employer.
About the role
This role focuses on providing high-level applications support for complex optical overlay measurement systems within the Semiconductor Products and Customers (Semi PC) business unit, specifically the Optical Metrology Division (OMD).
What you'll do
- Provide high-level applications support for complex Overlay measurement systems to internal teams and external customer engineers.
- Manage in-house customer demonstrations and head-to-head (H2H) activities at customer sites.
- Develop use cases and design experiments to characterize tool/subcomponent performance and demonstrate product value during alpha testing, beta testing, and pilot tool support.
- Develop recipes to model complex optical applications and optimize tool performance.
- Provide escalation support to onsite field service engineers, leading and coordinating remote/local troubleshooting.
What you'll need
- MS or PhD in Physics, or related engineering fields such as optics, materials science, and microelectronics.
- 0 years of related work experience for Master's Level Degree or PhD's Level Degree.
- Excellent problem-solving and analytical skills.
- Proficient in the English language and able to work effectively with different cultures.
Nice to have
- Matlab/Python experience.
This role has been open 28 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 512 | 10125 · 107 employers |
| Median days open | 138 d | 63 d (+75 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.