Quantum Interposer Design Engineer - Oregon, Hillsboro, United States
$141,910 - $200,340 USD yearly
Originally posted 23 September 2026 by the employer.
About the role
This role involves the physical design and integration of advanced packaging interposers within a multidisciplinary team. You will contribute to advancing Intel's silicon quantum dot technology and the development of scalable quantum systems.
What you'll do
- Perform physical design and integration of interposers for advanced packaging in quantum computing.
- Collaborate with stakeholders, incorporating feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers.
- Conduct design validation and verification, including DRC and LVS.
- Deliver and disseminate design milestones to stakeholders.
- Communicate designs through presentations and relevant documentation.
- Stay updated on packaging technology and design techniques by attending conferences and reading papers.
What you'll need
- M.S. degree in Electrical Engineering AND 5+ years of experience in physical design of silicon testchips, interposers, and/or related hardware; OR Ph.D. degree in Electrical Engineering with academic or work experience in related areas.
- Experience with Cadence Virtuoso.
- Understanding of how signal and power integrity (SI/PI) impacts physical design.
- Understanding of advanced packaging technologies.
Nice to have
- Strong understanding of superconducting metals.
- Proven experience with Synopsys and Ansys software packages for APR (automated place and route).
Skills: interposer design, advanced packaging, quantum computing, Cadence Virtuoso, signal integrity
This role has been open 0 days — well below the 79-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Chiplet Interconnect
|
Open roles in category
41
|
Median days open
79 d
|
Median salary
$217k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (41 roles · 19 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 41 |
| Median days open | 20 d | 79 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $217k |
Skills observed across this category: interposer design, advanced packaging, quantum computing, Cadence Virtuoso, signal integrity
Who's hiring in this category
- Marvell Technology · 5 open roles · median 22 d
- Qualcomm · 5 open roles · median 86 d
- Micron Technology · 4 open roles · median 133 d
- NVIDIA · 4 open roles · median 45 d
- AMD · 3 open roles · median 48 d
- Intel Corporation (this employer) · 3 open roles · median 20 d
How we counted: 41 open Chiplet/Advanced Packaging Design (Chiplet Interconnect) roles from 19 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.