Quantum IC Package Substrate Design Engineer - Oregon, Hillsboro, United States
$122,440 - $172,860 USD yearly
Originally posted 23 September 2026 by the employer.
This role focuses on advancing silicon quantum dot technology.
About the role
This role involves the design of large form factor IC substrates for Intel's quantum computing team. The position contributes to the development of scalable quantum systems leveraging silicon quantum dot technology.
What you'll do
- Design IC substrates using Siemens Xpedition IC package design software.
- Collaborate with stakeholders to meet design requirements from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers.
- Deliver design milestones to stakeholders.
- Perform design validation and verification, including DRC and LVS.
- Integrate advanced packaging designs (2.5D and 3D) with IC substrates.
- Manage tapeout of designs with substrate suppliers in collaboration with Intel substrate teams.
What you'll need
- B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures; OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
- Experience with Siemens Xpedition design environment and workflow.
- Experience with high-speed signal routing.
- Experience with large form factor IC substrates.
Nice to have
- 1+ years of experience with advanced routing engines for IC substrate design.
- Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.
Skills: IC substrate design, Siemens Xpedition, advanced packaging design integration, 2.5D and 3D, high-speed signal routing, quantum computing
This role has been open 0 days — well below the 41-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
67
|
Median days open
41 d
|
Median salary
$178k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (67 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 67 |
| Median days open | 6 d | 41 d (−35 d vs this employer) |
| Median salary (USD postings) | — | $178k |
Skills observed across this category: IC substrate design, Siemens Xpedition, advanced packaging design integration, 2.5D and 3D, high-speed signal routing, quantum computing
Who's hiring in this category
- Micron Technology · 13 open roles · median 146 d
- AMD · 6 open roles · median 30 d
- Marvell Technology · 6 open roles · median 16 d
- Broadcom · 5 open roles · median 166 d
- NVIDIA · 4 open roles · median 56 d
- Amazon · 3 open roles · median 15 d
How we counted: 67 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.