Process Engineers - Urgent Hiring (WB, DA, MOLD, NPI, DIE PREP) - Muntinlupa, Philippines
About the role
Process Engineers support assembly operations across Wirebond, Die-Attach, Mold, NPI, and Die Prep lines.
What you'll do
- Support semiconductor packaging operations across WIREBOND, DIE-ATTACH, MOLD, DTFS, LASER MARK, NPI, and DIE PREP processes. - Implement and maintain quality control systems utilizing 7QC tools, FMEA, 8D, Control Plan, and SPC methodologies. - Work on rotating shifts to maintain continuous manufacturing and line support as necessary.
What you'll need
- Minimum of 3 years of working experience in a related field. - Bachelor's degree, College Degree, or Professional License in Chemical, Electrical/Electronic, Industrial, Mechanical, Mechatronic/Electromechanical Engineering, or an equivalent field. - Hands-on knowledge of WIREBOND, DIE-ATTACH, MOLD, DTFS, LASER MARK, NPI, or DIE PREP processes. - Direct familiarity with 7QC tools, FMEA, 8D, Control Plan, and SPC. - Willingness to work on rotating shifts when necessary.
Skills: wirebond, die-attach, mold, SPC, FMEA
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Amkor | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 51 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: wirebond, die-attach, mold, SPC, FMEA
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.