Process Engineering Intern - Milpitas, CA, United States
Originally posted 14 October 2026 by the employer.
About the role
As a member of the Engineering Team, the Process Engineering Intern will work alongside experienced engineers on business-critical packaging projects.
What you'll do
- Work alongside experienced engineers to gain practical experience and execute engineering projects. - Perform statistical data analysis and execute Design of Experiments (DoE) to evaluate process variables. - Maintain accurate documentation, visual records, and physical modeling descriptions for experiments and process solutions. - Support engineering evaluations across semiconductor backend assembly and equipment workflows.
What you'll need
- Currently pursuing a Bachelor’s or Master’s degree in mechanical engineering, Material Science, Chemical Engineering, or similar. - Base knowledge of mechanical and/or chemical engineering. - Expertise in AUTOCAD and SolidWorks designs. - Data analysis and DoE capabilities. - Precise documentation abilities.
Nice to have
- Experience in a semiconductor backend (assembly) environment. - JMP or similar software for statistical data analysis. - 3D printing, modeling, or machining capabilities. - Equipment knowledge of Datacon EVO220 or other backend assembly equipment (SMT, Bonding, Laser Cutting).
Skills: backend assembly, die attach, Datacon EVO220, wire bonding, SolidWorks
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
220
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | MACOM | All employers we track in this specialty (220 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 220 |
| Open roles in the wider Process, Fab & Equipment family | 90 | 10278 · 109 employers |
| Median days open | 0 d | 57 d (−57 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: backend assembly, die attach, Datacon EVO220, wire bonding, SolidWorks
Who's hiring in this category
- Renesas Electronics · 31 open roles · median 37 d
- Infineon Technologies · 25 open roles · median 36 d
- Micron Technology · 20 open roles · median 77 d
- onsemi · 16 open roles · median 33 d
- Skyworks · 12 open roles · median 10 d
- Intel Corporation · 11 open roles · median 112 d
How we counted: 220 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 28 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.