Process Engineer Co-op/Intern - Canada - Ottawa (Bill Leathem), Canada
Originally posted 1 September 2026 by the employer.
About the role
This role involves designing and developing robotic process engineering solutions within optical and photonic manufacturing, with a focus on NPI & R&D for telecom and data center applications.
What you'll do
- Design, perform, and document experiments with 6-axis industrial robots.
- Develop advanced routines for commissioning, calibration, and motion optimization.
- Perform failure analysis, collect data, and perform SPC (Statistical Process Control).
- Develop and integrate machine vision solutions for part detection, measurement, and station setup.
- Design, prototype, and validate custom end-of-arm tooling and robot jigs.
- Work with 3D printing, basic machining, and epoxy-based assembly.
What you'll need
- Currently studying B.Eng. in mechanical, electrical, mechatronic, or similar discipline.
- Hands on experience that includes mechanical assemblies, epoxy application, packaging process and equipment.
- Programming experience (e.g., Python, C#, C++, URScript, KAREL).
- Familiarity with machine vision tools and basic optics concepts.
- Experience with CAD software (SolidEdge, SolidWorks, or equivalent).
- Familiarity with Lab/manufacturing tools: Microscopes, Coordinate measuring machines (CMM), profilometers, 3D printers, etc.
This role has been open 22 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumentum | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 9525 · 109 employers |
| Median days open | 22 d | 58 d (−36 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.