Process Engineer - Advanced Packaging R&D - Santa Clara, CA, United States
$147,000 - $202,500 USD yearly
Originally posted 28 October 2026 by the employer.
About the role
As a Process Engineer in Advanced Packaging R&D, you will design and optimize manufacturing processes for display and semiconductor manufacturing technologies.
What you'll do
- Design, collect data, analyze, and compile reports on complex process engineering experiments across multiple products. - Utilize techniques and define methods to characterize hardware across complex systems. - Generate internal and external documentation, technical reports, presentations, and process engineering specifications. - Develop, plan, and execute process engineering projects within established safety guidelines. - Train engineers on measurement techniques of film properties, data interpretation, troubleshooting techniques, and issue resolution. - Communicate directly with customers to resolve complex process engineering issues and collaborate with vendors and suppliers.
What you'll need
- Bachelor’s degree in a related field. - 7-10 years of related experience. - Demonstrated conceptual and practical expertise in complex problem solving. - Experience with hardware characterization across complex equipment systems. - Demonstrated background in measuring film properties and troubleshooting engineering issues.
Skills: advanced packaging, process engineering, film properties, hardware characterization, R&D
This role has been open 0 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
298
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (298 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 298 |
| Open roles in the wider Process, Fab & Equipment family | 1149 | 10282 · 107 employers |
| Median days open | 124 d | 63 d (+61 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: advanced packaging, process engineering, film properties, hardware characterization, R&D
Who's hiring in this category
- KLA Corporation · 42 open roles · median 140 d
- Micron Technology · 41 open roles · median 44 d
- Intel Corporation · 20 open roles · median 53 d
- Renesas Electronics · 17 open roles · median 45 d
- GlobalFoundries · 14 open roles · median 72 d
- Lumilens · 13 open roles · median 83 d
How we counted: 298 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.