Process Development Engineer - Richardson, TX, United States
Originally posted 21 July 2026 by the employer.
About the role
Develop and optimize SMT, semiconductor packaging, and advanced assembly processes supporting both volume and New Product Introduction (NPI) manufacturing. The role focuses on surface mount electronics, Flip Chip Attach, and Die Attach for fine-pitch components.
What you'll do
- Develop and optimize SMT, semiconductor packaging, and advanced assembly processes for volume and NPI production. - Support manufacturing operations for surface mount electronics (SMT), Flip Chip Attach, and Die Attach. - Lead process characterization, DOE execution, and process window development while evaluating new equipment, processes, and materials. - Monitor product yields daily, execute corrective actions, and generate post build/DFM reports. - Collaborate with fixturing vendors to design and support assembly tooling in the factory. - Develop process documentation, work instructions, control plans, and manufacturing standards while mentoring technicians and operators.
What you'll need
- BS in Mechanical, Electrical, Manufacturing, Material engineering, or a related discipline (or postgraduate degree accepted in lieu of industry experience). - 2+ years of industry experience in semiconductor packaging assembly. - Semiconductor assembly experience with high-density fine-pitch components, including BGA, LGA, QFN, 0201, and 01005 components.
Nice to have
- MS degree in an engineering discipline. - Relevant industry internship experience. - 1-2 years of experience in a mid to high-volume manufacturing environment. - Experience with reflow, pick and place, and solder paste printing. - Experience with SPC techniques and Lean practices. - Knowledge of IPC-A-610 standard.
Skills: SMT, semiconductor packaging, advanced assembly processes, Flip Chip Attach, Die Attach, process characterization
This role has been open 90 days — well above the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
206
|
Median days open
61 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (206 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 206 |
| Open roles in the wider Process, Fab & Equipment family | 65 | 9979 · 109 employers |
| Median days open | 70 d | 61 d (+9 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: SMT, semiconductor packaging, advanced assembly processes, Flip Chip Attach, Die Attach, process characterization
Who's hiring in this category
- Renesas Electronics · 27 open roles · median 34 d
- Infineon Technologies · 24 open roles · median 49 d
- Micron Technology · 23 open roles · median 132 d
- onsemi · 13 open roles · median 27 d
- Monolithic Power Systems · 11 open roles · median 213 d
- Intel Corporation · 9 open roles · median 104 d
How we counted: 206 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 19 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.