Process Development Engineer - Ball attach and package saw process - Muar, Malaysia
Originally posted 11 September 2026 by the employer — open 11 days.
About the role
This role focuses on developing, optimizing, and industrializing PLP Ball Attach and Package Saw processes.
What you'll do
- Develop, set up, and industrialize PLP Ball Attach and Package Saw processes.
- Support the introduction of new products, materials, and technologies into assembly manufacturing.
- Characterize PLP Ball Attach and Package Saw processes and related materials.
- Prepare, review, and update process specifications, SOPs, FMEAs, and process control plans.
- Conduct process optimization to improve quality, yield, productivity, and reliability.
- Provide technical support for process-related issues and troubleshooting.
What you'll need
- Bachelor’s, Master’s, or PhD degree in Engineering or a related field (Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology, or Material Science).
- More than 3 years of relevant experience in process development, semiconductor manufacturing, or assembly processes.
- Strong statistical data analysis skills.
- Solid analytical and problem-solving skills with experience in 8D, DMAIC, Process Mapping, Fishbone analysis, and 5 Whys.
- Strong understanding of production environments and manufacturing operations.
Skills: PLP Ball Attach, Package Saw processes, assembly manufacturing, process optimization, transfer molding
This role has been open 0 days — well below the 68-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
194
|
Median days open
68 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (194 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 194 |
| Open roles in the wider Process, Fab & Equipment family | 267 | 9417 · 108 employers |
| Median days open | 13 d | 68 d (−55 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: PLP Ball Attach, Package Saw processes, assembly manufacturing, process optimization, transfer molding
Who's hiring in this category
- Infineon Technologies · 27 open roles · median 33 d
- Renesas Electronics · 20 open roles · median 25 d
- Micron Technology · 17 open roles · median 144 d
- Intel Corporation · 12 open roles · median 150 d
- Monolithic Power Systems · 12 open roles · median 186 d
- onsemi · 7 open roles · median 66 d
How we counted: 194 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.