Skip to main content
AMD

Principal Signal/Power Integrity Engineer

AMD MY, Penang, Malaysia Full-time 7 months ago
Analog & Mixed-Signal Design

About the role

This Principal Signal/Power Integrity Engineer will lead Signal Integrity and Power Integrity simulations for AECG characterization and demo board designs. This role focuses on developing design trade-offs and directions within Power Integrity teams.

What you'll do

  • Conduct Signal Integrity and Power Integrity simulations at feasibility, pre-layout, and post-layout phases.
  • Establish design and layout guidelines for SI/PI.
  • Coordinate with hardware design, layout, NPI, and manufacturing teams to resolve SI/PI issues.
  • Perform end-to-end channel simulations for multi-gigabit serial lines such as 56Gbps and 112Gbps.
  • Analyze Power Integrity for HBM, DDR4, LPDDR4, DDR5, LPDDR5, and other memory buses.
  • Characterize product interfaces and verify simulations against measurements.
  • Implement checklists for PCB development stages.
  • Collaborate with architecture, package design, and PCB design teams for future PCB technology.
  • Automate and update SIPI design and analysis flows.

What you'll need

  • MS or PhD in Electrical Engineering.
  • Expertise in Power Integrity and Signal Integrity.
  • Experience with Signal Integrity and Power Integrity simulations for AECG characterization board and demo board design.
  • Experience with end-to-end channel simulations for multi-gigabit serial lines.
  • Experience with PI analysis simulations of HBM, DDR4, LPDDR4, DDR5, LPDDR5, and other memory buses.
  • Experience characterizing interfaces in products and verifying simulations against measurements.
  • Experience preparing and implementing checklists for PCB development.
  • Experience working with architecture, package design, and PCB design teams for future PCB technology.
  • Experience updating SIPI design and analysis flow and automating the process.

Nice to have

  • Experience with PCB, Package, and IC level power delivery networks.
  • Experience in silicon packaging and PCB design for signal and power integrity.
  • Experience with high-speed digital signaling interfaces such as PCIE, GDDR6, HDMI.
  • Expertise in electrical modeling EDA and AMS tools such as ADS, HFSS, SIwave, HSPICE.
  • Expertise in electromagnetic theory and circuit analysis.
  • Experience with programming in Python, C++, Matlab.

Skills: signal integrity (SI), power integrity (PI), multi-gigabit serial lines, HBM/DDR5, PCB design, packaging

Market context

This role has been open 139 days — well above the 89-day median for High-Speed IO/SerDes Design roles.

High-Speed IO/SerDes Design · Serdes Highspeed

Open roles in category
215
Median days open
89 d
Median salary
$184k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How AMD compares in High-Speed IO/SerDes Design hiring
Metric AMD Market (215 open roles · 44 companies)
Open roles in category 24 215
Median days open 60 d 89 d (−29 d vs this employer)
Median salary (USD postings) — $184k

Skills observed across this category: signal integrity (SI), power integrity (PI), multi-gigabit serial lines, HBM/DDR5, PCB design, packaging

Who's hiring in this category

  • AMD (this employer) · 24 open roles · median 60 d
  • Cadence Design Systems · 19 open roles · median 152 d
  • Qualcomm · 18 open roles · median 68 d
  • Synopsys · 16 open roles · median 52 d
  • Broadcom · 11 open roles · median 141 d
  • Micron Technology · 9 open roles · median 126 d

Based on 215 open roles at 44 companies in our index. Snapshot 9 Sept 2026.

Apply now
MY, Penang, Malaysia
On-site
Full-time
7 months ago

Share this job