Principal Process Engineer - DRAM and Memory Applications
Originally posted 27 October 2026 by the employer.
About the role
As a Principal Process Engineer at ASM, you will leverage semiconductor processing and analytical equipment to research, develop, and optimize advanced thin-film processes for DRAM and memory applications. Your work focuses on Atomic Layer Deposition (ALD, PEALD), Epitaxy, PECVD, oxidation, annealing, and curing processes used in highly scaled memory structures.
What you'll do
- Develop and optimize deposition processes for DRAM and emerging memory applications utilizing ALD, PEALD, Epitaxy, and PECVD technologies. - Drive process innovation for memory-critical films, including high-k dielectrics, capacitor materials, metal electrodes, barrier layers, and conductors. - Support technology development addressing DRAM scaling challenges such as capacitor formation, buried word lines, advanced patterning, and high-aspect-ratio structures. - Design and execute experiments using Design of Experiments (DOE) and Response Surface Methodology (RSM) to optimize process performance. - Analyze electrical, physical, and materials characterization data to evaluate film properties and device performance. - Collaborate with customers to define requirements, execute demonstrations, and deliver process solutions for memory integration challenges.
What you'll need
- Master's or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related technical discipline. - 7+ years of combined industry, research, and/or academic experience with advanced thin-film deposition technologies including ALD, PEALD, CVD, PECVD, Epitaxy, oxidation, and annealing. - Direct experience in DRAM, NAND, or emerging memory device development and integration. - Background in high-k dielectrics and thin-film materials characterization.
Skills: ALD, Epitaxy, DRAM, thin-film, PECVD
This role has been open 0 days — well below the 70-day median for Process Engineering roles.
Process Engineering · Semiconductor Process
|
Open roles in category
1066
|
Median days open
70 d
|
Median salary
$137k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (1066 roles · 56 employers) |
|---|---|---|
| Open roles in this specialty | 28 | 1066 |
| Open roles in the wider Process, Fab & Equipment family | 262 | 10147 · 107 employers |
| Median days open | 154 d | 70 d (+84 d vs this employer) |
| Median salary (USD postings) | — | $137k |
Skills observed across this category: ALD, Epitaxy, DRAM, thin-film, PECVD
Who's hiring in this category
- Micron Technology · 333 open roles · median 131 d
- GlobalFoundries · 88 open roles · median 90 d
- Applied Materials · 81 open roles · median 69 d
- Texas Instruments · 58 open roles · median 56 d
- STMicroelectronics · 50 open roles · median 49 d
- Entegris · 44 open roles · median 42 d
How we counted: 1066 open Process Engineering (Semiconductor Process) roles from 56 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.