Principal Packaging Engineer - Irvine, CA, United States
$129,400 - $247,800 USD yearly
About the role
This role involves leading the development of advanced semiconductor packaging and assembly technologies. You will lead the development of packaging solutions for RF and wireless products.
What you'll do
- Lead development, qualification, and production ramp of advanced semiconductor packaging technologies.
- Drive process innovation across MCM, chip-and-wire, flip-chip, and SiP assembly platforms.
- Define and execute DOE plans, process optimization strategies, and root-cause investigations.
- Improve product performance, manufacturability, yield, reliability, and cost through process and technology development.
- Evaluate and introduce new materials, equipment, and assembly processes.
What you'll need
- BS degree in Mechanical Engineering, Materials Science, Process Engineering, Electrical Engineering, or a related discipline.
- 12+ years of experience in semiconductor packaging, assembly process development, or advanced manufacturing (8+ years with an MS degree).
- Proven success developing and transferring packaging technologies into high-volume production.
- Deep expertise in SMT (Surface Mount Technology), Wire Bond, Molding, Singulation, EMI Sputter Shielding, ENIG Plating, Wafer DPS, Flip-Chip Assembly, Materials Development, or related semiconductor assembly processes.
Nice to have
- Strong background in DOE, SPC, FMEA, and process characterization.
- Solid understanding of semiconductor reliability methodologies and qualification standards.
- Experience with advanced packaging technologies such as WLFO, Wafer Bumping, RDL, heterogeneous integration, or advanced SiP solutions.
- Experience supporting RF, wireless, or high-frequency semiconductor products.
- Understanding of DFM and design rule methodologies.
- Package design experience using Cadence Allegro, APD, or SiP design tools.
Skills: advanced semiconductor packaging, assembly technologies, MCM, flip-chip, SiP, WLFO, heterogeneous integration
This role has been open 11 days — well below the 55-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
55 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 7 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 106 | 9346 · 108 employers |
| Median days open | 11 d | 55 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: advanced semiconductor packaging, assembly technologies, MCM, flip-chip, SiP, WLFO
Who's hiring in this category
- KLA Corporation · 49 open roles · median 102 d
- Micron Technology · 36 open roles · median 29 d
- Renesas Electronics · 21 open roles · median 21 d
- Infineon Technologies · 20 open roles · median 41 d
- Intel Corporation · 13 open roles · median 76 d
- Lumilens · 13 open roles · median 45 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.