Principal Member of Technical Staff, LCM Advanced Packaging & Manufacturing Engineer - Taipei, Taiwan
Originally posted 22 May 2026 by the employer.
Lead NPI and advanced packaging for Light Control Metasurface (LCM) beam-forming chips across Taiwan and China OSAT partners.
About the role
Lumotive is seeking a Principal Member of Technical Staff based in Taiwan with deep expertise in New Product Introduction (NPI) and production management for semiconductor advanced packaging and test of optical devices. The role links design and production across wafer fab, OSAT, LCOS assembly, optical sub-assembly, and test suppliers for Light Control Metasurface (LCM) optical modules.
What you'll do
- Own technical engagement and production support with OSATs, LCOS assembly, optical sub-assembly, test vendors, and wafer fab partners. - Travel up to 50% of the time to supplier sites across Taiwan and China to align deliverables, troubleshoot issues, and mitigate project risks. - Lead NPI assembly process development for LCM-based optical modules, transitioning from low-volume builds to scalable production. - Define, develop, and qualify advanced packaging architectures including flip-chip, wafer-level assembly, fan-out, and CoC using ACF, TCB, or LAB. - Serve as the on-site production test interface between suppliers and the in-house test team, handling Level 1 troubleshooting, yield tracking, and test station readiness. - Apply configuration management and quality workflows (RMA, SCAR, CAPA) while driving yield improvement, process optimization, and failure analysis feedback.
What you'll need
- Bachelor's degree in Mechanical Engineering, Manufacturing Engineering, Materials Science, or a related field (MS/PhD preferred). - 12+ years of industry experience, including 10+ years in supplier-facing manufacturing, process, quality, or NPI engineering roles. - Proven experience in DFM and process design for opto-mechanical and opto-electronic systems, as well as semiconductor packaging, LCOS, or MEMS assembly. - Hands-on experience with wafer bonding, dicing, AOI, wire bonding, optical alignment, and advanced packaging techniques. - Experience with PLM, MES, and SPC systems, as well as tools such as Arena, SolidWorks, Tableau, and JMP. - Professional fluency in Mandarin and English.
This role has been open 124 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumotive | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 5 | 10147 · 107 employers |
| Median days open | 124 d | 63 d (+61 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.